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 | Aremco-Bond 2310 Ultra High Strength Adhesive Now Available Aremco Products, Inc., Valley Cottage, NY 26 Mar 2013 Aremco-Bond(tm) 2310, a new ultra high strength, flexible, high temperature epoxy adhesive produced by Aremco Products, Inc., is now available for applications requiring a tensile shear strength to 4,770 psi and operating temperatures to 325°F (165°C).  | ||
 | Dimensionally Stable Epoxy Based UV Curable System with High Temperature Resistance Master Bond Inc, Hackensack, NJ 21 Aug 2012 With its outstanding light transmission properties and optical clarity, Master Bond UV15 is widely used for a variety of bonding, coating and sealing applications in the optical, electronic and optoelectronic industries. This epoxy based UV curable system is 100% reactive and does not contain any solvents or other volatiles. It is also completely free of any oxygen inhibition. | ||
 | High Strength, One Component Epoxy Meets NASA Low Outgassing Specifications Master Bond Inc, Hackensack, NJ 27 Jul 2012 Master Bond Supreme 10HT is a uniquely versatile system that combines high shear and peel strengths with convenient handling. This one part system eliminates mixing and cures in just 60-75 minutes at 250°F. It can withstand severe cryogenic temperatures to extreme heat with a temperature range of 4K to +400°F. | ||
 | Flexibilized, Thermally Conductive One Part B-Stage Epoxy Resists High Temperatures Master Bond Inc, Hackensack, NJ 2 Jul 2012 Formulated for electrical potting and encapsulation applications, Master Bond EP36AO combines high thermal conductivity with thermal stability. This flexible, heat resistant epoxy has superior mechanical properties. | ||
 | One Part Epoxy Offers Exceptionally High Tensile Strength Master Bond Inc, Hackensack, NJ 1 Mar 2012 Primarily used for testing the adhesion or cohesive strength of flame sprayed coatings as per the ASTM C633 specification, Master Bond EP15 produces high strength bonds across a wide variety of applications. This one component epoxy bonds well to many similar and dissimilar substrates. Particularly noteworthy is its adhesion to metals and ceramics. | ||
 | New Electrically Conductive, Silver Filled Adhesive/Sealant is USP Class VI Approved Master Bond Inc, Hackensack, NJ 17 Jan 2012 Developed for rigorous bonding and sealing in demanding manufacturing applications, Master Bond EP3HTSMED epoxy system features a rapid cure schedule and a tensile shear strength exceeding 1,000 psi. It is 100% reactive and fully meets USP Class VI requirements for medical applications. | ||
 | High Performance, UV Curable Epoxy with Enhanced Chemical Resistance Master Bond Inc, Hackensack, NJ 21 Nov 2011 Combining superior physical strength and fast cure rates, Master Bond UV16 is formulated for demanding bonding, sealing, and coating applications. It is a one component, no mix system and cures in one minute or less at room temperature with commercial UV light sources. | ||
 | Medical Grade Epoxy Adhesive Withstands High Temperatures and Repeated Sterilization Master Bond Inc, Hackensack, NJ 21 Jul 2011 Capable of tolerating the harsh environments of the medical industry, Master Bond EP42HT-2ND2MED (Black) fully complies with the testing requirements of USP Class VI plastics. This two component epoxy resists recurrent autoclaving and sterilizations including radiation, steam, ethylene oxide, and chemical sterilants. | ||
 | Low Viscosity, Room Temperature Curing Epoxy Complies With FDA and USP Class VI Requirements Master Bond Inc, Hackensack, NJ 14 Jun 2011 HACKENSACK, NJ – Ideal for potting and encapsulation applications, Master Bond EP21LV features a low viscosity and outstanding electrical insulation properties. It is broadly used in the medical and food industries, as it conforms to USP Class VI and Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 requirements. | ||
 | Food Grade Epoxy Resists High Temperatures & Harsh Conditions Tested and Certified to Meet FDA CFR 175.30 Master Bond Inc, Hackensack, NJ 1 Jun 2011 Master Bond is pleased to announce the release of EP42HT-2FG, a new food grade epoxy system. EP42HT-2FG has been independently tested and certified by a leading national laboratory to meet the stringent requirements of FDA CFR 175.300. It also was toxicologically evaluated to meet the NSF/ANSI 51.4.1 (2009) standard for food equipment materials. | ||
 | Low Thermal Expansion Epoxy Passes NASA Low Outgassing Tests Master Bond Inc, Hackensack, NJ 22 Apr 2011 Formulated with a special blend of polymeric and inorganic materials, Master Bond EP30LTE-LO features unparalleled dimensional stability and sets new standards of performance for bonding, sealing, casting and coating applications in the aerospace, electrical, electronic, chemical, optical, and computer industries. This two component epoxy combines outstanding performance with a very low thermal expansion coefficient, a significant breakthrough from the high thermal expansion that is typical of most epoxy compounds. | ||
 | Optically Clear, Highly Flexible Epoxy Cures at Room Temperature and Withstands Cryogenic Conditions Master Bond Inc, Hackensack, NJ 31 Mar 2011 For demanding applications where highly flexible, impact resistant bonds are required, Master Bond developed Polymer System EP37-3FLF. This optically clear, two component epoxy has exceptional resistance to cryogenic temperatures and severe thermal cycling. Its low exotherm also makes it a superb potting, encapsulating and casting system, especially where wider cross section thicknesses are specified. Its unique combination of properties allows it to cure without stressing delicate electronic components. | ||
 | Chemically Resistant Epoxy Withstands a Year in Sulfuric & Hydrochloric Acid! Master Bond Inc, Hackensack, NJ 7 Mar 2011 For applications demanding exceptional chemical resistance, especially to acids, fuels, and oils, Master Bond has developed EP21AR. Whether coating, lining, bonding or sealing, this two-component epoxy can withstand harsh, acidic environments, including prolonged immersion in 96-98% sulfuric acid and 36% hydrochloric acid for over a year. | ||
 | Silver Conductive Epoxy Meets NASA Low Outgassing Standards Master Bond Inc, Hackensack, NJ 9 Feb 2011 Master Bond EP21TDCS-LO is an electrically conductive silver-filled epoxy that passes ASTM 595 for NASA low outgassing specifications. It is widely used for demanding applications in the electronic, electrical, computer, semiconductor, aerospace and optical industries. | ||
 | High Temperature Resistant, Toughened Structural Adhesive Cures at Room Temperature Master Bond Inc, Hackensack, NJ 24 Jan 2011 Formulated for structural applications in extreme environments with temperatures from -80°F to +425°F, Master Bond Supreme 33 has superior resistance to thermal cycling, thermal shock and impact. This toughened, two-component epoxy offers high structural bond strength to a wide variety of substrates including metals, glass, ceramics, wood, vulcanized rubbers and many plastics. Supreme 33 also resists chemicals including water, oil and many organic solvents. | ||
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